Phillotto 3D probables hearing winning nofor today 2 5 14?

Is a mile more than 6000 feet?

It depends on the type of mile.A statute mile (regular mile) is 5280 feet, so nofor this one.A nautical mile is 6076.11549 feet. So yes for the nautical mile.Then there is something called a RADAR mile, which is equal to 6000 feet.

When is Shawn micheals coming back to the WWE 2013-2014?

Shawn Micheal's will only return as a guest host of raw and this is extremely trueAs a full-time wrestler - NOFor part time appearances like Promos and Storyline developments - Yes. Most recently he came back to help Triple H and Randy Orton in their feud with Daniel Bryan

Does mass effect the distance an object will travel?

Newton's second law of motionForce causes a mass to accellerateReplace the word "causes" with an equal sign and you will have Newton's Second Law of Motion.Force = Mass * AccelerationThe answer depends on the type of motion.If you push an object on a surface with friction, I think the answer is yes, but let's work a problem and see.Friction force = coefficeint of friction * mass * gravityFriction force always decreases the velocity of an object, so it is usually negative.I will give you an example:A 2 kg object is sliding on a frictionless board at a speed of 25 m/s. It moves onto a board with a coefficient of friction of 0.5 between the object and the board.How far does it move until it stops?Friction force = coefficeint of friction * mass * gravityFriction force = -0.5 * 2 kg * 9.8 m/s^2Friction force = -9.8 NForce = Mass * Acceleration-9.8 N = 2 Kg * aa = -4.9 m/s^2This means the object will slow down at the rate of 4.9 m/s each second.UsingEq.#1 Vfinal = Vinitial + (acceleration * time)Vfinal = 25m/s - 4.9 m/s each second * timetime = 5.1 secondsEq.#2 Average Velocity = (Vi + Vf) ÷ 2Average Velocity = (25m/s + 0 m/s) ÷ 2Average Velocity =12.5 m/sEq.#3 Distance = Average Velocity * timeDistance =12.5 m/s * 5.1 secondsDistance = 63.75 mNow notice what happens when the mass is 4 KgFriction force = -0.5 * 4kg * 9.8 m/s^2Friction force = -19.6 NForce = Mass * Acceleration-19.6 N = 4Kg * aa = -4.9 m/s^2uh-oh. -4.9 m/s^2 is the same acceleration as when the mass was 2 kg, and the mass does not appear in the rest of the equations. I am sure glad I worked this problem. The answer to your question is NoFor falling objects, I know the answer is No. Do you trust me?I will give you an example:A 2 kg object and a 4 kg object are dropped from a height of 10 m. They will both drop to the ground, which is 10 m down. However, a more interesting fact is they both will hit the ground at the same time!When dropping objects the object's weightis theforce pulling it down.Weight = Mass * gravityWeight = 2 kg * 9.8 m/s^2 =19.6 NForce = Mass * Acceleration19.6 N= 2* Acceleration Acceleration = 19.6 N÷ 2 Acceleration = 9.8m/s^2Weight = Mass * gravityWeight = 4 kg * 9.8 m/s^2 = 39.2 NForce = Mass * Acceleration39.2 N= 2 * Acceleration Acceleration = 39.2 N ÷ 2 Acceleration = 9.8m/s^2Everything accelerates at the same rate as it falls to the ground, neglecting air resistance which depends on the shape of the objects.Of course. if you get to travel to the moon, things are different, right? Find out what the value of gravity is on the moon and try this last

What percentage of each metal is used to make solder?

CompositionSnPbAgCuSbBiInZnCdAuoth.M.p. °CS/LToxicEutecticCommentsPb98Sn2298316/322[11]PbnoNon-critical sealing and joining. Body solder.Pb97Sn3397314/320[12]PbnoSn3[12]Pb96Sn4496299/310[11]PbnoUsed for coating steel and copper, to provide resistance against mild acids and seawater.Pb95Sn5595308/312[13] 301/314[4]PbnoSn5, UNS L54320, ASTM5A, ASTM5B, Indalloy 171.[14] Low cost and good bonding properties. Used for coating steel and copper. Used in both SMT (Surface-mount technology) and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those.[15] useful for high-temperature service and step soldering. Remains ductile at very low temperatures, can be used for parts subject to vibration at cryogenic applications. Pb93.5Sn5Ag1.5 provides superior wetting and better strength.[16]Pb93Sn7793288/308[11]PbnoUsed for coating steel to provide corrosion resistance, allows subsequent soldering.Pb90Sn101090268/302[13] 275/302[12]PbnoSn10, UNS L54520, ASTM10B, Indalloy 159. Balls for CBGA components, replaced by SnAg3.9Cu0.6.[9] Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those.[15] Used for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.[11] Has low thermal EMF, can be used as an alternative to Cd70 where parasitic thermocouple voltage has to be avoided.[17]Pb88Sn121288254/296[11]PbnoUsed for fabrication of car radiators and fuel tanks, for coating and bonding of metals for moderate service temperatures. Body solder.Pb85Sn151585227/288[11]PbnoUsed for coating tubes and sheets and fabrication of car radiators. Body solder.Pb80Sn202080183/280[12]PbnoSn20, UNS L54711. Used for coating radiator tubes for joining fins.[11]Pb75Sn252575183/266[13]PbnoCrude solder for construction plumbing works, flame-melted. Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.[11]Pb70Sn303070185/255[13] 183/257[12]PbnoSn30, UNS L54280, crude solder for construction plumbing works, flame-melted, good for machine and torch soldering.[18] Used for soldering car engine radiators. Used for machine, dip and hand soldering of plumbing fixtures and fittings. Superior body solder.[11]Pb68Sn323268253Pbno"Plumber solder", for construction plumbing works[19]Pb68Sn30Sb230682185/243[12]PbnoPb68Pb67Sn333367187-230PbnoPM 33, crude solder for construction plumbing works, flame-melted, temperature depends on additivesPb65Sn353565183/250[12]PbnoSn35. Used as a cheaper alternative of Sn60Pb40 for wiping and sweating joints.[11]Pb60Sn404060183/238[13] 183/247[12]PbnoSn40, UNS L54915,. For soldering of brass and car radiators.[18] For bulk soldering, and where wider melting point range is desired. For joining cables. For wiping and joining lead pipes. For repairs of radiators and electrical systems.[11]Pb55Sn454555183/227[11]PbnoFor soldering radiator cores, roof seams, and for decorative joints.Sn50Pb505050183/216[13] 183-212[12]PbnoSn50, UNS L55030,. "Ordinary solder", for soldering of brass, electricity meters, gas meters, formerly also tin cans. General purpose, for standard tinning and sheetmetal work. Becomes brittle below −150 °C.[10][19] Low cost and good bonding properties. Rapidly dissolves gold and silver, not recommended for those.[15] For wiping and assembling plumbing joints for non-potable water.[11]Sn50Pb49Cu150491183/215[12]PbnoCu1Sn50Pb48.5Cu1.55048.51.5183/215[20]PbnoSavbit, Savbit 1, Sav1. Minimizes dissolution of copper. Originally designed to reduce erosion of the soldering iron tips. About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires.[16]Sn60Pb406040183/190[13] 183/188[12]PbnearSn60, ASTM60A, ASTM60B. Common in electronics, most popular leaded alloy for dipping. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those.[15] Slightly cheaper than Sn63Pb37, often used instead for cost reasons as the melting point difference is insignificant in practice. On slow cooling gives slightly duller joints than Sn63Pb37.[16]Sn60Pb38Cu260382183/190[12][21]PbCu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder.Sn60Pb39Cu160391PbnoSn62Pb386238183Pbnear"Tin man's solder"[19]Sn63Pb376337182 183[22]PbyesSn63, ASTM63A, ASTM63B. Common in electronics; exceptional tinning and wetting properties, also good for stainless steel. One of most common solders. Low cost and good bonding properties. Used in both SMT and through-hole electronics. Rapidly dissolves gold and silver, not recommended for those.[15] Sn60Pb40 is slightly cheaper and is often used instead for cost reasons, as the melting point difference is insignificant in practice. On slow cooling gives slightly brighter joints than Sn60Pb40.[16]Sn63Pb37P0.0015-0.046337P183[23]PbyesSn63PbP. A special alloy for HASL machines. Addition of phosphorus reduces oxidation. Unsuitable for wave soldering as it may form metal foam.Sn62Pb37Cu162371183[21]PbyesSimilar to Sn63Pb37. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten solder.Sn70Pb307030183/193[13]PbnoSn70Sn90Pb109010183/213[12]Pbnoformerly used for joints in food industrySn95Pb5955238Pbnoplumbing and heatingPb92Sn5.5Ag2.55.5922.5286/301[21]PbnoFor higher-temperature applications.Pb80Sn12Sb812808PbnoUsed for soldering iron and steel[19]Pb80Sn18Ag218802252/260[12]PbnoUsed for soldering iron and steel[19]Pb79Sn20Sb120791184/270PbnoSb1Pb55Sn43.5Sb1.543.5551.5PbnoGeneral purpose solder. Antimony content improves mechanical properties but causes brittleness when soldering cadmium, zinc, or galvanized metals.[19]Sn43Pb43Bi14434314144/163[13]PbnoBi14, Indalloy 97. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth.[24] Useful for step soldering.Sn46Pb46Bi846468120/167[12]PbnoBi8Bi52Pb32Sn1616325296Pbyes?Bi52. Good fatigue resistance combined with low melting point. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.[24]Bi46Sn34Pb20342046100/105[12]PbnoBi46Sn62Pb36Ag262362179[13]PbyesSn62. Common in electronics. The strongest tin-lead solder. Appearance identical to Sn60Pb40 or Sn63Pb37. Crystals of Ag3Sn may be seen growing from the solder. Extended heat treatment leads to formation of crystals of binary alloys. Silver content decreases solubility of silver, making the alloy suitable for soldering silver-metallized surfaces, e.g. SMD capacitors and other silver-metallized ceramics.[10][16][24] Not recommended for gold.[15] General-purpose.Sn62.5Pb36Ag2.562.5362.5179[13]PbyesPb88Sn10Ag210882268/290[13] 267/299[25]PbnoSn10, Pb88, Indalloy 228. Silver content reduces solubility of silver coatings in the solder. Not recommended for gold.[15] Forms a eutectic phase, not recommended for operation above 120 °C.Pb90Sn5Ag55905292[13]PbyesPb92.5Sn5Ag2.5592.52.5287/296[13] 299/304[12]PbnoPb93, Indalloy 151. Similar to Indalloy 165.Pb93.5Sn5Ag1.5593.51.5296/301[13] 305/306[12]PbnoPb94, HMP alloy, HMP. Service temperatures up to 255 °C. Useful for step soldering. Also can be used for extremely low temperatures as it remains ductile down to −200 °C, while solders with more than 20% tin become brittle below −70 °C. Higher strength and better wetting than Pb95Sn5.[16]Pb95.5Sn2Ag2.5295.52.5299/304[13]PbnoIn97Ag3397143[26]-yesIndalloy 290. Wettability and low-temperature malleability of indium, strength improved by addition of silver. Particularly good for cryogenic applications. Used for packaging of photonic devices.In90Ag101090143/237[27]-noIndalloy 3. Nearly as wettable and low-temperature malleable as indium. Large plastic range. Can solder silver, fired glass and ceramics.In75Pb252575156/165[15]PbnoLess gold dissolution and more ductile than lead-tin alloys. Used for die attachment, general circuit assembly and packaging closures.[15]In70Pb303070160/174[13] 165/175[12][28]PbnoIn70, Indalloy 204. Suitable for gold, low gold-leaching. Good thermal fatigue properties.In60Pb404060174/185[13] 173/181[12]PbnoIn60, Indalloy 205. Low gold-leaching. Good thermal fatigue properties.In50Pb505050180/209[15] 178/210[12]PbnoIn50, Indalloy 7. Only one phase. Resoldering with lead-tin solder forms indium-tin and indium-lead phases and leads to formation of cracks between the phases, joint weakening and failure.[24] On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic.[29] Less gold dissolution and more ductile than lead-tin alloys.[15] Good thermal fatigue properties.In50Sn505050118/125[30]-noIndalloy 1, Cerroseal 35. Fairly well wets glass, quartz and many ceramics. Malleable, can compensate some thermal expansion differences. Low vapor pressure. Used in low temperature physics as a glass-wetting solder.[31]In70Sn15Pb9.6Cd5.4159.6705.4125[32]Pb,CdIndalloy 13Pb75In257525250/264[15] 240/260[33]PbnoIn25, Indalloy 10. Low gold-leaching. Good thermal fatigue properties. Used for die attachment of e.g. GaAs dies.[29] Used also for general circuit assembly and packaging closures. Less dissolution of gold and more ductile than tin-lead alloy.[15]Sn70Pb18In12701812162[13]154/167[34]PbyesIndalloy 9. General purpose. Good physical properties.Sn37.5Pb37.5In2537.537.525134/181[15]PbnoGood wettability. Not recommended for gold.[15]Pb90In5Ag59055290/310[13]PbnoPb92.5In5Ag2.592.52.55300/310[13]PbnoUNS L51510, Indalloy 164. Minimal leaching of gold, good thermal fatigue properties. Reducing atmosphere frequently used..Pb92.5In5Au2.592.552.5300/310[12]PbnoIn5Pb94.5Ag5.594.55.5305/364[12] 304/343[35]PbnoAg5.5, UNS L50180, Indalloy 229Pb95Ag5955305/364[36]PbnoIndalloy 175Pb97.5Ag2.597.52.5303[13] 304[12] 304/579[37]Pbyes noAg2.5, UNS L50132, Indalloy 161. Used during World War II to conserve tin. Poor corrosion resistance; joints suffered corrosion in both atmospheric and underground conditions, all had to be replaced with Sn-Pb alloy joints.[38] Torch solder.Sn97.5Pb1Ag1.597.511.5305PbyesImportant for hybrid circuits assembly.[10]Pb97.5Ag1.5Sn1197.51.5309[13]PbyesAg1.5, ASTM1.5S, Indalloy 165. High melting point, used for commutators, armatures, and initial solder joints where remelting when working on nearby joints is undesirable.[18] Silver content reduces solubility of silver coatings in molten solder. Not recommended for gold.[15] Standard PbAgSn eutectic solder, wide use in semiconductor assembly. Reducing protective atmosphere (e.g. 12% hydrogen) often used. High creep resistance, for use at both elevated and cryogenic temperatures.Pb54Sn45Ag145541177-210Pbexceptional strength, silver gives it a bright long-lasting finish; ideal for stainless steel[18]Pb96Ag4964305Pbhigh-temperature joints[18]Pb96Sn2Ag22962252/295[12]PbPb96Sn61Pb36Ag361363Pb[10]Sn56Pb39Ag556395Pb[10]Sn98Ag2982-[10]Sn65Ag25Sb10652510233-yesIndalloy 209. Very high tensile strength. For die attachment. Very brittle. Old Motorola die attach solder.Sn96.5Ag3.0Cu0.596.530.5217/220 217/218[12][39]-nearSAC305, Indalloy 256, SN97C. Predominantly used in Japan. It is the JEITA recommended alloy for wave and reflow soldering, with alternatives SnCu for wave and SnAg and SnZnBi for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4-0.85%, e.g. by refilling the bath with Sn97Ag3 alloy (designated e.g. SN97Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.Sn95.8Ag3.5Cu0.795.83.50.7217-218-nearSN96C-Ag3.5 A commonly used alloy. Used for wave soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4-0.85%, e.g. by refilling the bath with Sn96.5Ag3.5 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.Sn95.6Ag3.5Cu0.995.63.50.9217-yesDetermined by NIST to be truly eutectic.Sn95.5Ag3.8Cu0.795.53.80.7217[40]-almostSN96C. Preferred by the European IDEALS consortium for reflow soldering. Usable also for selective soldering and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4-0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.Sn95.25Ag3.8Cu0.7Sb0.2595.253.80.70.25-Preferred by the European IDEALS consortium for wave soldering.Sn95.5Ag3.9Cu0.695.53.90.6217[41]-yesIndalloy 252. Recommended by the US NEMI consortium for reflow soldering. Used as balls for BGA/CSP and CBGA components, a replacement for Sn10Pb90. Solder paste for rework of BGA boards.[9] Alloy of choice for general SMT assembly.Sn95.5Ag4Cu0.595.540.5217[42]-yesIndalloy 246. Prior-art use makes it patent-free.Sn96.5Ag3.596.53.5221[13]-yesSn96, Sn96.5, 96S, Indalloy 121. Fine lamellar structure of densely distributed Ag3Sn. Annealing at 125 °C coarsens the structure and softens the solder.[9] Creeps via dislocation climb as a result of lattice diffusion.[8] Used as wire for hand soldering rework; compatible with SnCu0.7, SnAg3Cu0.5, SnAg3.9Cu0.6, and similar alloys. Used as solder spheres for BGA/CSP components. Used for step soldering and die attachment in high power devices. Established history in the industry.[9] Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.[15] Marginal wetting. Good for step soldering. Used for soldering stainless steel as it wets stainless steel better than other soft solders. Silver content does not suppress dissolution of silver metallizations.[16] High tin content allows absorbing significant amount of gold without embrittlement.[43]Sn96Ag4964221-229-noASTM96TS. "Silver-bearing solder". Food service equipment, refrigeration, heating, air conditioning, plumbing.[18] Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.[15]Sn95Ag5955221/240[15]-noSn95. Widely used. Strong lead-free joints. Silver content minimizes solubility of silver coatings. Not recommended for gold.[15]Sn95Ag4Cu19541-Sn99.99232-pureSn99. Good strength, non-dulling. Use in food processing equipment, wire tinning, and alloying.[18] Susceptible to tin pest.Sn99.3Cu0.799.30.7(Ni)227-yesIndalloy 244, Sn99Cu1. Also designated as Sn99Cu1. Cheap alternative for wave soldering, recommended by the US NEMI consortium. Coarse microstructure with ductile fractures. Sparsely distributed Cu6Sn5.[44] Forms large dendritic β-tin crystals in a network of eutectic microstructure with finely dispersed Cu6Sn5. High melting point unfavorable for SMT use. Low strength, high ductility. Susceptible to tin pest.[8] Addition of small amount of nickel increases its fluidity; the highest increase occurs at 0.06% Ni. Such alloys are known as nickel modifiedor nickel stabilized.[45] An example with 0.05% Ni is designated SN100C. The properties degrade with dissolved copper; at above 0.85% the alloy tends to form bridges between part leads. At above 0.9% Cu needles of copper-tin intermetallic precipitate and settle at the bottom of the solder bath. The alloy attacks steel less than the tin-silver-copper alloys, allowing use of stainless steel solder pots. Slower wetting than Sn63Pb37.[46]Sn99Cu0.7Ag0.3990.30.7217/228[47]-noSCA, SAC, or SnAgCu. Tin-silver-copper alloy. Relatively low-cost lead-free alloy for simple applications. Can be used for wave, selective and dip soldering. At high temperatures tends to dissolve copper; copper buildup in the bath has detrimental effect (e.g. increased bridging). Copper content must be maintained between 0.4-0.85%, e.g. by refilling the bath with Sn96.2Ag3.8 alloy (designated e.g. SN96Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals.Sn97Cu3973227/250[48] 232/332[11]-For high-temperature uses. Allows removing insulation from an enameled wire and applying solder coating in a single operation. For radiator repairs, stained glass windows, and potable water plumbing.Sn97Cu2.75Ag0.25970.252.75228/314[11]-High hardness, creep-resistant. For radiators, stained glass windows, and potable water plumbing. Excellent high-strength solder for radiator repairs. Wide range of patina and colors.Zn100100419-pureFor soldering aluminium. Good wettability of aluminium, relatively good corrosion resistance.[49]Bi100100271-pureUsed as a non-superconducting solder in low-temperature physics. Does not wet metals well, forms a mechanically weak joint.[31]Sn91Zn9919199-yesIndalloy 201. Cheaper alloy, prone to corrosion and oxidation. Recommended for soldering aluminium.[19] Fair wetting of aluminium, fair corrosion rating.[38] Room temperature tensile strength twice of SnPb37. High drossing. Solder paste has short shelf-life.Zn95Al595Al5382-yesFor soldering aluminium. Good wetting.[49]Sn91.8Bi4.8Ag3.491.83.44.8211/213[50]-noIndalloy 249. Do not use on lead-containing metallizations. U.S. Patent 5,439,639 (ICA Licensed Sandia Patent).Sn70Zn307030199/311-noFor soldering of aluminium. Good wetting.[38]Pb63Sn35Sb235632185/243[12]PbnoSb2Pb63Sn34Zn334633170/256PbnoPoor wetting of aluminium. Poor corrosion rating.[38]Pb92Cd8928310?Pb,Cd?For soldering aluminium. US patent 1,333,666.[51]Sn48Bi32Pb20482032140/160[21]PbnoFor low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting.Sn89Zn8Bi38938191-198-Prone to corrosion and oxidation due to its zinc content. On copper surfaces forms a brittle Cu-Zn intermetallic layer, reducing the fatigue resistance of the joint; nickel plating of copper inhibits this.[52]Sn83.6Zn7.6In8.883.68.87.6181/187[53]-noIndalloy 226. High dross due to zinc. Covered by U.S. Patent #5,242,658.Sn86.5Zn5.5In4.5Bi3.586.53.54.55.5174/186[54]-noIndalloy 231. Lead-free. Corrosion concerns and high drossing due to zinc content.Sn86.9In10Ag3.186.93.110204/205[55]-Indalloy 254. Potential use in flip-chip assembly, no issues with tin-indium eutectic phase.Sn95Ag3.5Zn1Cu0.5953.50.51221L[52]-noSn95Sb5955235/240[13] 232/240[12]-noSb5, ASTM95TA, Indalloy 133. The US plumbing industry standard. It displays good resistance to thermal fatigue and good shear strength. Forms coarse dendrites of tin-rich solid solution with SbSn intermetallic dispersed between. Very high room-temperature ductility. Creeps via viscous glide of dislocations by pipe diffusion. More creep-resistant than SnAg3.5. Antimony can be toxic. Used for sealing chip packagings, attaching I/O pins to ceramic substrates, and die attachment; a possible lower-temperature replacement of AuSn.[8] High strength and bright finish. Use in air conditioning, refrigeration, some food containers, and high-temperature applications.[18] Good wettability, good long-term shear strength at 100 °C. Suitable for potable water systems. Used for stained glass, plumbing, and radiator repairs.Sn97Sb3973232/238[56]-noIndalloy 131Sn99Sb1991232/235[57]-noIndalloy 129Sn99Ag0.3Cu0.7990.30.7-Sn96.2Ag2.5Cu0.8Sb0.596.22.50.80.5217-225 217[12]-Ag03A. Patented by AIM alliance.Sn88In8.0Ag3.5Bi0.5883.50.58197-208-Patented by Matsushita/Panasonic.Bi57Sn42Ag142157137/139 139/140[58]-Indalloy 282. Addition of silver improves mechanical strength. Established history of use. Good thermal fatigue performance. Patented by Motorola.Bi58Sn424258138[13][15]-yesBi58, Indalloy 281, Indalloy 138, Cerrothru. Reasonable shear strength and fatigue properties. Combination with lead-tin solder may dramatically lower melting point and lead to joint failure.[24] Low-temperature eutectic solder with high strength.[15] Particularly strong, very brittle.[13] Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature was required. Can be used as a coating of copper particles to facilitate their bonding under pressure/heat and creating a conductive metallurgical joint.[52] Sensitive to shear rate. Good for electronics. Used in thermoelectric applications. Good thermal fatigue performance.[59] Established history of use. Expands slightly on casting, then undergoes very low further shrinkage or expansion, unlike many other low-temperature alloys which continue changing dimensions for some hours after solidification.[31]Bi58Pb424258124/126[60]PbIndalloy 67In80Pb15Ag515580142/149[12]149/154[61]PbnoIn80, Indalloy 2. Compatible with gold, minimum gold-leaching. Resistant to thermal fatigue. Can be used in step soldering.Pb60In406040195/225[12]PbnoIn40, Indalloy 206. Low gold-leaching. Good thermal fatigue properties.Pb70In307030245/260[12]PbnoIn30Sn37.5Pb37.5In2637.537.526134/181[12]PbnoIn26Sn54Pb26In20542620130/154[12] 140/152[62]PbnoIn20, Indalloy 532Pb81In198119270/280[12] 260/275[63]PbnoIn19, Indalloy 150. Low gold-leaching. Good thermal fatigue properties.In52Sn484852118-yesIn52, Indalloy 1E. Suitable for the cases where low-temperature soldering is needed. Can be used for glass sealing.[52] Sharp melting point. Good wettability of glass, quartz, and many ceramics. Good low-temperature malleability, can compensate for different thermal expansion coefficients of joined materials.Sn52In485248118/131[13]-novery low tensile strengthSn58In425842118/145[64]-noIndalloy 87Sn51.2Pb30.6Cd18.251.230.618.2145[65]Pb,CdyesIndalloy 181. General-purpose. Maintains creep strength well. Unsuitable for gold.Sn77.2In20Ag2.877.22.820175/187[66]-noIndalloy 227. Similar mechanical properties with Sn63Pb37, Sn62Pb36Ag2 and Sn60Pb40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C.In74Cd267426123[67]CdyesIndalloy 253.In61.7Bi30.8Cd7.530.861.77.562[68]CdyesIndalloy 18Bi47.5Pb25.4Sn12.6Cd9.5In512.625.447.559.557/65[69]Pb,CdnoIndalloy 140Bi48Pb25.4Sn12.8Cd9.6In412.825.4489.661/65[70]Pb,CdnoIndalloy 147Bi49Pb18Sn15In181518491858/69[71]PbnoIndalloy 21Bi49Pb18Sn12In211218492158PbyesCerrolow 136. Slightly expands on cooling, later shows slight shrinkage in couple hours afterwards. Used as a solder in low-temperature physics.[31]Bi50.5Pb27.8Sn12.4Cd9.312.427.850.59.370/73[72]Pb,CdnoIndalloy 22Bi50Pb26.7Sn13.3Cd1013.326.7501070Pb,CdyesCerrobend. Used in low-temperature physics as a solder.[31]Bi44.7Pb22.6In19.1Cd5.3Sn8.38.322.644.719.15.347Cd,PbyesIndalloy 117, Cerrolow 117. Used as a solder in low-temperature physics.[31]In60Sn404060113/122[13]-noIn51.0Bi32.5Sn16.516.532.55160.5-yesField's metalBi49.5Pb27.3Sn13.1Cd10.113.127.349.510.170.9Pb,CdyesLipowitz MetalBi50.0Pb25.0Sn12.5Cd12.512.5255012.571Pb,CdyesWood's metal, mostly used for casting.Bi50.0Pb31.2Sn18.818.831.25097PbnoNewton's metalBi50Pb28Sn22222850109PbnoRose's metal. It was used to secure cast iron railings and balusters in pockets in stone bases and steps. Does not contract on cooling.Cd95Ag5595338/393340/395[73]CdIndalloy 185. melts at 338 °C, flows at 393 °C; for high-temperature applications, for soldering aluminium to itself or to other metals.[19] Braze 053. For medium-strength joints. For low-temperature brazing.Cd82.5Zn17.517.582.5265CdFor soldering aluminium and die-cast zinc alloys.[19] Used in cryogenic physics for ataching electrical potential leads to specimens of metals, as this alloy does not become superconductive at liquid helium temperatures.[31]Zn90Cd109010265/399CdFor soldering aluminium. Good wetting.[49]Zn60Cd406040265/335CdFor soldering aluminium. Very good wetting.[49]Cd70Sn3029.5670.44140/160[12]CdnoCd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics.[31]Sn50Pb32Cd18503218145[12]Cd,PbCd18Sn40Pb42Cd18404218145[74]Cd,PbLT145. Low melting temperature allows repairing pewter and zinc objects, including die-cast toys.Zn70Sn303070199/376-noFor soldering aluminium. Excellent wetting.[38] Good strength.Zn60Sn404060199/341-noFor soldering aluminium. Good wetting.[49]Zn95Sn5595382-yes?For soldering aluminium. Excellent wetting.[38]Sn90Au109010217[75]-yesIndalloy 238.Au80Sn202080280-yesAu80, Indalloy 182, Premabraze 800. Good wetting, high strength, low creep, high corrosion resistance, high thermal conductivity, high surface tension, zero wetting angle. Suitable for step soldering. The original flux-less alloy, does not need flux. Used for die attachment and attachment of metal lids to semiconductor packages, e.g. kovar lids to ceramic chip carriers. Coefficient of expansion matching many common materials. Due to zero wetting angle requires pressure to form a void-free joint. Alloy of choice for joining gold-plated and gold-alloy plated surfaces. As some gold dissolves from the surfaces during soldering and moves the composition to non-eutectic state (1% increase of Au content can increase melting point by 30 °C), subsequent desoldering requires higher temperature.[76] Forms a mixture of two brittle intermetallic phases, AuSn and Au5Sn.[77] Brittle. Proper wetting achieved usually by using nickel surfaces with gold layer on top on both sides of the joint. Comprehensively tested through military standard environmental conditioning. Good long-term electrical performance, history of reliability.[29] Low vapor pressure, suitable for vacuum work. Generally used in applications that require a melting temperature over 150°C.[78] Good ductility. Also classified as a braze.Au98Si298Si2370/800[12]-Au98, Indalloy 194. A non-eutectic alloy used for die attachment of silicon dies. Ultrasonic assistance is needed to scrub the chip surface so a eutectic (3.1% Si) is reached at reflow.Au96.8Si3.296.8Si3.2370[12] 363[79]-yesAu97, Indalloy 184. [76] AuSi3.2 is a eutectic with melting point of 363 °C. AuSi forms a meniscus at the edge of the chip, unlike AuSn, as AuSi reacts with the chip surface. Forms a composite material structure of submicron silicon plates in soft gold matrix. Tough, slow crack propagation.[44]Au87.5Ge12.587.5Ge12.5361 356[12]-yesAu88, Indalloy 183. Used for die attachment of some chips.[13] The high temperature may be detrimental to the chips and limits reworkability.[29]Au82In181882451/485[12]-noAu82, Indalloy 178. High-temperature, extremely hard, very stiff.In10099.99157-pureIn99. Used for die attachment of some chips. More suitable for soldering gold, dissolution rate of gold is 17 times slower than in tin-based solders and up to 20% of gold can be tolerated without significant embrittlement. Good performance at cryogenic temperatures.[80] Wets many surfaces incl. quartz, glass, and many ceramics. Deforms indefinitely under load. Does not become brittle even at low temperatures. Used as a solder in low-temperature physics, will bond to aluminium. Can be used for soldering to thin metal films or glass with an ultrasonic soldering iron.[31]

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